Viewed products

  • IEC...

    IEC 60704-2-16 Ed ....>>

  • IEC...

    IEC 62631-3-4 Ed ....>>

Home>IEC/TR 62878-2-7 Ed. 1.0 en:2019

IEC/TR 62878-2-7 Ed. 1.0 en:2019

IEC/TR 62878-2-7 Ed. 1.0 en:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

standard by International Electrotechnical Commission - Technical Report, 03/20/2019

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$34.44 tax incl.

$82.00 tax incl.

(price reduced by 58 %)

1000 items in stock

Full Description

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Product Details

Edition: 1.0 Published: 03/20/2019 Number of Pages: 12 File Size: 1 file , 2.6 MB